Sputter deposition is one of the most important steps used extensively in semiconductor manufacturing process. Sputtering equipment are used abundantly in the wafer fabrication and integrated circuit manufacturing process in order to deposit thin layer of different material on the substrate. In many cases, anti-reflection coatings on glass is also obtained using the sputtering process. Various categories of sputtering equipment are used for depositing layers of silver or metal oxide such as zinc oxide, titanium dioxide and tin oxide among others on the substrate or wafers. The market of sputtering equipment across the globe is anticipated to experience a stable growth during the forecast period from 2017 – 2025, owing to rapid technological advancements taking place in the semiconductor industry in order to manufacture technologically advanced integrated circuits.
For the purpose of providing an in-depth and exhaustive analysis of the global sputtering equipment market, the market has been segmented on the basis of technology and application. Based in different technology used in the sputtering process, the market has been classified into magnetron sputtering, reactive sputtering and co-sputtering. In addition, information related to the demand of sputtering equipment across various application segments including, logic and memory, micro electro mechanical system (MEMS), power devices, CMOS (complementary metal oxide semiconductor) image sensor and radio frequency identification (RFID) devices is also provided in this report. Moreover, cross sectional analysis of sputtering equipment market in respect of technology and application across different regions including Asia Pacific, North America, Europe, Middle-East and Africa (MEA) and Latin America is also highlighted in this report.
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