Top 10 Manufacturers in Advanced Semiconductor Packaging : How It Is Going To Impact on Industry to Grow In Near Future
Semiconductor packaging provides protection to substrate and wafer. The materials used in packaging semiconductor are metal, plastic, ceramic or glass. However, manufacturers have started using some of the advanced semiconductor packaging technologies such as flip-chip, Fan-Out Wafer-Level Packaging (FO-WLP), Fan-In Wafer-Level Packaging (FI-WLP) and 2.5D and 3D packaging. Although 2.5D technology emerged as a bridge technology between 2D and 3D ICs, it has evolved as largely used package solution alongside 3D ICs. The demand for 3D packaging is increasing due to constantly evolving wearable and portable devices, and rapid development of electric vehicles. Also, High-Bandwidth Memory (HBM) technology is which is already implemented in 2.5D packaging is also expected to improve the power efficiency of IC packages. Top three emerging trends that are contributing towards the growth of the advanced semiconductor packaging market are the integration of semiconductor in vehicles...