Flip Chip Market to Observe Strong Development by 2027
Allied Market Research, titled, “ Flip Chip Market by Packaging Technology, Bumping Technology, and Industry: Opportunity Analysis and Industry Forecast, 2020–2027 ,” the flip chip market size was valued at $24.76 billion in 2019, and is projected to reach $39.67 billion by 2027, growing at a CAGR of 6.1% from 2020 to 2027. Increase in demand for high speed and compact size electronic products has boosted the adoption of flip chip technology in the electronic industry. Internet of Things (IoT) has been gaining popularity, and serves as a key driver of the market. Products used in IoT, such as sensors & actuators, analog & mixed-signal translators, and microcontrollers or embedded processors require efficient and reliable packaging solutions, which can be done using flip chips. In comparison to customary wire-bond packaging, flip chip offers various benefits such as, superior thermal & electrical performance, substrate flexibility for varying perfo...