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Showing posts with the label Pin Fin Heat Sink for IGBT Market

Advances in Technologies Widen Market Opportunities for Pin Fin Heat Sink for IGBT Use

Pin Fin Heat Sink for IGBT: Introduction Pin fin heat sinks are made of aluminum alloys or copper and contains the base and array of embedded pins. Its parameters such as base plate dimensions, pin length, material, thickness, as well as density fits most of the specifications. The pin fin can be easily customized to be used in various applications depending on the heat load, available space, and airflow. The pin fin heat sink technology offers an efficient cooling solution as it has a large surface area in relation to other heat sink volumes. Its round pins and spacing allows the blown air to create significant amount of turbulence. This breaks the boundary layer around pins, which creates high convective thermal efficiencies. Pin fin heat sinks have higher efficiency than other heat sinks which results in smaller and lighter pin fin heat sinks. It contains bonding agents and therefore most plating methods ...