Advances in Technologies Widen Market Opportunities for Organic Substrate Packaging Material Use
Organic substrates are used as base materials in semiconductor applications and manufacturing. Unlike inorganic substrates, the organic substrates are made of organic small molecules or polymers. Organic small molecules are polycyclic aromatic compounds, such as pentacene, anthracene, and rubrene. Packaging materials are not only used for mechanical or environmental safety, but they also act as electrically conductive interconnect between semiconductors and PCBs. Organic packaging materials, similar to other packaging materials, also facilitate heat distribution, signal distribution, manufacturability and serviceability, and power distribution. They vary in functionality and dimensions. Various packaging technologies are used for packaging such as Small Outline Packages (SOP), Quad Flat packages (QFP), Dual In-line package (DIP), leadless chip career, pin grade array, ball grid array, quad flat no-leads packages, chip scale, system in package, 2.5 D integrated c...