Ball Bonder Machine Market: 2020 Industry Analysis, Size, Trends, Growth and Forecast 2030

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Ball Bonder Machine: Introduction

  • Ball bonder machine is a machine used to enable interconnection between ICs (Integrated Circuits) or any semiconductor device at the time of chip packaging. The connection is established using a thin wire which is generally made of copper, aluminum, gold, or silver. This connection is established through the ball bonding process, which uses a combination of pressure, heat, and ultrasonic energy to make a weld at each end of the wire and chip.
  • Ball bonder machines are used in various applications across various end-user segments such as Outsourced Semiconductor Assembly and Testing (OSATs) and Integrated Device Manufacturers (IDMs).
  • The global ball bonder machine market is projected to expand at a rapid pace during the forecast period, due to increasing demand for ball bonder machines from end-users.

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