Sputtering target technology is used for thin film deposition through physical vapor deposition (PVD) technique. In this, a substrate to be coated is put into a vacuum space comprising two magnets. Then, a controlled gas such as krypton or argon is introduced in a chamber. Owing to this, the magnets attract atoms from the substrate. These atoms then hit each other in their gaseous state after which they contract into a plasma. After they dry, a uniform and high quality film is formed on the substrate. The finished product thus results into a thin but durable coating effective across several applications. Metal targets are offered in several purity ranges to suit the specific requirements, with the minimum purity of 99.9% up to 99.99% for some metals while 99.995%-99.9995+% for ultra-high purity requirement.
Increasing demand for thin film manufacturing technologies in digital electronics and semiconductor sector is driving the sputtering target market across the world. Yet, apart from semiconductor and digital electronics, sputtering target market is expected to find lucrative opportunities in optoelectronics and life sciences during the forecast period. However, sputtering target materials with limited sources can act as a limiting factor for this market. In spite of this, increasing R&D investment to discover new deposition technologies and utilize alternate alloys and compounds is expected to reduce the impact of the limitation during the forecast period.
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