Electronic Power Packages Market: Introduction
- Electronic
packaging is the enclosure for electronic devices, which ranges from
individual semiconductor devices to systems such as mainframe computers.
The packaging provides protection from mechanical damage, cooling, noise
emission, and electrostatic discharge.
- Electronic
power packages use silicon devices and lead-free solder
alloys in its construction. Manufacturers of power electronics are
transitioning to devices with wide band gap materials for improved
performance, reliability, and cost. Further, high temperature bonded
interface materials are facilitating compact, lightweight, low cost, and
reliable electronic power packaging.
- Electronic
power packages have applications in various industries such as automotive,
aerospace & defense, consumer electronics, industrial, and other
industries where power electronics are used.
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Increasing need for power packages due to environmental
and technical requirements
- The
need for electronic power packages is increasing due to growing technical
requirements from manufacturers of electronic devices as well as
environmental mandates from governments. The increasing power density and
power conversion optimization for power electronics will cause CO2
emission reduction. Hence, technological advancements are required for
devices to achieve government targets and volume content.
- Moreover,
the growing importance of wide band gap semiconductors makes electronic
power packages mandatory. These factors are driving the growth of the
electronic power packages market.
Increasing usage of electronic packaging by aerospace and
defense industry
- Increasing
investment by governments in aerospace and defense, and rising export of
weapons is fueling the electronic power packages market. Several equipment
in aerospace and defense such as data processing units and data display
units are loaded with semiconductor devices, which need electronic power
packages.
- Moreover,
high power electronic devices play an important role in improvement of
grid reliability, and are used in energy storage systems and other
applications. These factors are creating opportunities for the electronic
power packages market.
Maximum Growth to be observed in the Asia Pacific Market
- In
terms of region, the global electronic power packages market can be
divided into North America, Europe, Asia Pacific, South America, and
Middle East & Africa
- The
electronic power packages market in Asia Pacific is anticipated to expand
at the maximum CAGR during the forecast period.
- This
growth is attributed to a wide range of applications in industries such as
automobile, aerospace & defense, and consumer electronics, adoption of
advanced technologies by countries such as Japan, Taiwan, and China,
increasing investments, rising industrialization, and other factors. This
is expected to increase the demand for electronic power package products.
- The
electronic power packages market in North America and Europe is also
likely to witness high growth rate due to increasing competition among
players, and focus on cost of production. The market in Middle East &
Africa is likely to show slow growth rate.
Key Players in the Global Market
The global electronic power packages market is highly
concentrated. Prominent players operating in the global market are focusing on
product launch and technological developments to meet the growing demand for
electronic power packages.
Key players operating in the global electronic power
packages market include:
- ABB
- Infineon
Technologies
- ON
Semiconductor
- STMicroelectronics
- Others
Global Electronic Power Packages Market: Research Scope
Global Electronic Power Packages Market, by Industry
Vertical
- Automotive
- Aerospace
and Defense
- Consumer
Electronics
- Industrial
- Energy
and Power
- Others
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regional segments are covered comprehensively:
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America
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- Europe
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