Wafer Cutting Blades: Introduction
- Wafer
cutting blades are used for a variety of applications and
materials which includes cutting of silicon, compound semiconductor, and
glass wafer. These blades are suitable for OEM manual as well as automatic
wafer saws such as ADT, disco, accretech, loadpoint, and others.
- Optimal
wafer cutting is done by maximizing the abrasive concentration and size,
and selecting the correct cutting speed and load. The optimal wafer
cutting is done for delicate samples or sectioning the samples for very
precise location.
- Wafering
blades are used for materials such as silicon substrate, gallium arsenide,
boron composites, ceramic fiber composites, glasses, and minerals.
According to the material, blades with grit concentration is selected.
Integration of microelectronics into consumer electronics
- Microelectronics
have been integrated into consumer electronics and hence the increasing
need for thinner wafers. The equipment used for processing thin wafers
includes cutting equipment and wafer processing equipment. Electronics
such as MEMS, RFID, and power devices are the major sources of demand for
wafer cutting blades.
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- Wafer
cutting blades have extensive applications in semiconductors, aerospace
and defense, medical electronics, and other sectors. These factors are
increasing the demand for wafer cutting blades.
Automation of wafer back grinding equipment
- Increasing
automation of wafer back grinding equipment is enabling high quality and
reduction of wafer thickness to less than 0.050 mm. Also, demand for
better manufacturing processes for processing and dicing is a major factor
driving the production of thin wafer.
Maximum Growth to be observed in the Asia Pacific Market
- In
terms of region, the global wafer cutting blades market can be divided
into North America, Europe, Asia Pacific, South America, and Middle East
& Africa
- The
wafer cutting blades market in Asia Pacific is anticipated to expand at
the maximum CAGR during the forecast period.
- This
growth is attributed to a wide range of applications, increasing
investments by developing countries, growing applications of wafer cutting
blades, and increasing industrialization, leading to increasing demand for
wafer cutting blade products.
- The
wafer cutting blades market in North America and Europe is projected to
show stagnant growth rate while the market in Middle East & Africa is
likely to show slow growth due to high costs associated with deployment.
Key Players in the Global Market
The global wafer cutting blades market was highly
fragmented. Prominent players operating in the global market are focusing on
product launch and technological developments to meet the growing demand for
wafer cutting blades.
Key players operating in the global wafer cutting blades
market include:
- DISCO
Corporation
- ADT
- K
& S
- UKAM
- Ceiba
Global Wafer Cutting Blades Market: Research Scope
Global Wafer Cutting Blades Market, by Battery Type
- Fine
Grit
- Medium
Grit
- Coarse
Grit
- Others
Global Wafer Cutting Blades Market, by Application
- Semiconductors
- Solar
Wafers
- Others
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The study strives to evaluate the current and future growth
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region-wise assessment.
The following
regional segments are covered comprehensively:
- North
America
- Asia
Pacific
- Europe
- Latin
America
- The
Middle East and Africa
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